Muenzaniso wemuchina weRFID Chip Assembly: ST-FC180 Mufananidzo Unoratidzwa

RFID Chip Assembly Machine Model: ST-FC180

Tsananguro Dzakasiyana-siyana

RFIDMuchina weKuunganidza Machipisi Muenzaniso: ST-FC180
Muchina wekubatanidza chips weRFID wakakwana unoshandiswa paHF、UHF chip bonding, substrate web width (CD direction) kusvika 200MM, muchina wakabatanidzwa ne antenna unwind, glue dispense, die attach, hot press, QC verification, bad inlay dot, etc functions, 8 uye 12 inch ye wafer disk inoenderana, 6 inch ye wafer disk inofanira kushandiswa.yakagadzirirwayakagadzirwa.

Tibatei Iye Zvino Kuti Muwane Mienzaniso!!!

Tumira email kwatiri

info@focusrfid.com

+8618560195575

Ruzivo rweChigadzirwa

Matagi eChigadzirwa

Nhanganyaya

1. Midziyo iyi yakagadzirwa kuti ikwanise kugadzira RFID inlays uye chip bonding. Yakakodzera zvikuru kubatanidzwa kwe single-row flip-chip kwezvigadzirwa zvine maantenna asingaonekwe kana kuti akajeka (akadai sema antenna ePET akavakirwa papepa kana asingaonekwe).
2. Uchishandisa sisitimu yekuona zvinhu yakanakisa, muchina uyu unonyatsoona uye unowana machipisi madiki—anowanikwa mumatireyi—pamwe nemaantena anochinjika; mushure mezvo, maatomutakuri anomhanya zvikuru uye akanyatsojeka anoita kuti machipisi aya abatanidzwe nemazvo kumaantena.

Zvinhu zvirimo

Yakakodzera PET, antenna yepepa;
Substrate zvinhu Upamhi：30~200mm, ukobvu:≥50μm, nzvimbo yekubatanidza antenna iri pakati;
Wsaizi yedhisiki iri shure: 8&12 inch,
Wsaizi yepamusoro: 0.35*0.3mm kusvika 3*3mm panguva iyi;
Tkukora kwewafer: 0.075-0.16mm;
Guruu: ACP inogamuchirwa, NCP: haisati yasimbiswa;
Pmuganho wekukwenya mu X & Y axis:zvishoma15mm, 240mm yepamusoro (chirevo: kukwirira kwayo kunofanira kunge kuri nhamba yenhamba yakawanda pakati pe157 ne240mm)

Tsanangudzo yehunyanzvi

#	Paramita	Kukosha
1	Chiyero	L6000W1300H1750 (mm)
2	Huremu	Kurema kunosvika 2000 KG
3	Voltage Yakayerwa	Matanho matatu, AC380V
4	Simba Rakayerwa	Kusvika 16 KW
5	Kumanikidzwa kwemhepo	0.6 ~ 0.8 MPa
6	Kushandiswa Kwemhepo	Anenge 100 L/MIN
7	Nhamba yeMushandi	Munhu 1
8	Rudzi rweKudzora	PC
9	Sisitimu Yekushanda	Kunda 10
10	UPH	Pitch 25mm: 15000 pcs/awa
		Pitch 50mm: 7500 ~ 8000 pcs/awa
		Bhodhi remvura 150mm: 2600 pcs/awa
11	Goho	99.70%
12	Ruzha	≤85 DB
13	Die Batanidza Kururama	± 0.05 mm
14	Zvinyorwa zvekushandisa	Inlay yakaoma ye single up
15	Substrate	PET, bepa; ukobvu: ≥0.05 mm
16	Kuchinja Nekufamba Kwenguva — Kuchinja Kwakazara Kwechigadzirwa (antenna ne chip uye pamwe ACP/NCP)	Maminetsi angangoita zana nemakumi mashanu
17	Kuchinja Kwenguva — Wafer/Chip Chete	Maminetsi mashanu